PCB Layout CAD : DRC/MRC Settings

Other DRC Settings

The Other DRC Settings allows you to configure the following settings:

・The minimum number of thermal objects.
・Whether to create lands for through holes / vias that do not have a connection to a route / plane in inner layers.
・Whether to allow via stacking.
・The allowable distance between stacked vias.

For more details about opening the DRC/MRC Settings screen, refer to About DRC/MRC Settings.

Setting Items

Minimum No. of thermal connection
Item Description

Minimum No.of Connections

Specifies the minimum number of thermal connections that connect to dynamic planes.

Inner Layer Connection of Pad/Via
Item Description

Create the Inner Layer Land with no connection

Enables to create lands for through holes / vias that do not have a connection to a route / plane in inner layers.

For more details, see Convenient Functions for Inner Layers.

Via
Item Description

Allow Stack Via

Enables to connect multiple vias placed on the same coordinates.

Allowable Misalignment

Specifies the allowable distance to judge overlapping vias as Stack Via. If the center of each via is within the allowable value, a Same Net Clearance error will not be detected by DRC.