PCB Layout CAD : DRC/MRC Settings

Dynamic Plane Connection

By drawing a Dynamic Plane, it is possible to configure the Connection Width, number of Thermal Connections, and Clearance settings for each Net, and automatically change the shape.
All can be set as a batch, and you can adjust the shape for each Pad later.
By using a Dynamic Plane, you can minimize Plane Layer return work.
When executing a Dynamic Plane, there is also a Delete Unconnected Plane function available.

For more details about opening the DRC/MRC Settings screen, refer to About DRC/MRC Settings.

Plane Settings


Setting Method

First, in Settings, there is an "Assignment" tab and "Advanced Settings" tab.
The "Advanced Settings" tab is used for configuring actual settings, and the "Assignment" tab is used for configuring which settings are assigned to which Net.

About the Work Procedure

STEP 1: Create a Net Class from the "Net Class" tab
STEP 2: Configure settings in the "Advanced Settings" tab
STEP 3: Assign settings to the Net Class in the "Assignment" tab

The following will explain each setting tab.

Explanation of Each Setting Tab
Tab Name Content


It is possible to assign the "Settings" that are applied to Nets set in the "Net Class".

For example, you can create a "Power Supply Net Class (GND, VCC)" Net Class, and assign the setting for "Power Supply Net Settings".
When it is not necessary to divide settings for each Net, all Nets apply to "DefaultClass",
so, assign "DefaultSetting".
* All Nets not individually assigned in the Net Class are "DefaultClass".

Advanced Settings

Configures actual settings.
Multiple definition is possible for settings.



Advanced Settings

For more details about adding settings, refer to Adding Settings.

Connection Settings

For objects for which the connection shape applies, there are three types; "Pad", "SMD", and "Via".

Item Content


Configures Tear Drop Settings for Dip Pads.


Configures Tear Drop Settings for CHIP Pads (Pads without Drills).


Configures Tear Drop Settings for Vias.


It is possible to set the connection method for each shape.

Round Square Oblong Rectangle

Thermal Plane No Connection
Shapes with slits for improving heat dissipation Shapes that connect without Clearance Shapes with Clearance


Thermal" Settings

Item Content

Number of Connections

Configures the number of Thermal Spokes.

Connection Angle

The Thermal Spoke position can be changed by selecting from "90 degrees" and "45 degrees".

90 degrees 45 degrees

Connection Width (A)

Configures the Thermal Spoke Width.

Gap (B)

Configures the Clearance Width (Gap) from the Pad Land to the Plane.


No Connection" Settings

Item Content

Configures the Clearance Width from the Pad or Land to the Plane.


Layer Settings

For more details, refer to Layer Settings.


Assignment Settings

For more details, refer to Assignment Settings.